| 46.38 -0.74 (-1.57%) | 09-15 16:00 | |||||||||||||
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| Short term |  |
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| Mid term |  |
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| Targets | 6-month : | 65.02 | 1-year : | 72.55 |
| Resists | First : | 55.67 | Second : | 62.11 |
| Pivot price | 48.52 |
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| Supports | First : | 45.25 | Second : | 37.65 |
| MAs | MA(5) : | 49.22 |
MA(20) : | 49.11 |
| MA(100) : | 65.2 |
MA(250) : | 51.41  |
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| MACD | MACD : | -2.2 |
Signal : | -2.6 |
| %K %D | K(14,3) : | 41.8 |
D(3) : | 55.1 |
| RSI | RSI(14): 40.9 |
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| 52-week | High : | 96.5 | Low : | 25.97 |
Price has closed below its short-term moving average. Short-term moving average is currently below mid-term; and below long-term moving average. From the relationship between price and moving averages: This stock is BEARISH in short-term; and BEARISH in mid-long term.[ AMKR ] has closed above bottom band by 22.2%. Bollinger Bands are 63.1% narrower than normal. The narrow width of the bands suggests low volatility as compared to its normal range. The bands have been in this narrow range for 5 bars. This is a sign that the market may be about to initiate a new trend.
| If tomorrow: | Open lower | Open higher |
| High: | 47.92 - 48.22 | 48.22 - 48.43 |
| Low: | 45.02 - 45.39 | 45.39 - 45.65 |
| Close: | 45.9 - 46.44 | 46.44 - 46.82 |
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Wed, 16 Sep 2026
Corient Private Wealth LP Has $13.63 Million Holdings in Amkor Technology, Inc. $AMKR - MarketBeat
Tue, 15 Sep 2026
This NVDA Partner’s Stock Jumps 7% — Why UBS Sees 38% Upside For Amkor Technology - Stocktwits
Mon, 14 Sep 2026
A Look at Amkor Technology Inc (AMKR) After 8.9% Decline -- GF Value $35.56 vs Price $47.12 - GuruFocus
Mon, 14 Sep 2026
Amkor Technology Drops 6.3% Amid Sector-Wide Selling - AlphaStreet
Mon, 14 Sep 2026
Amkor: Customer Commitments Can Turn Packaging Capacity Into Earnings Power (AMKR) - Seeking Alpha
Mon, 14 Sep 2026
The Zacks Analyst Blog Highlights Amkor Technology, Ultra Clean, FormFactor, Taiwan Semiconducto and NVIDIA - Yahoo Finance
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Underperform |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Underperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Outperform |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Outperform |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Underperform |
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Exchange:
NASDAQ
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 248 (M) |
| Shares Float | 109 (M) |
| Held by Insiders | 49.9 (%) |
| Held by Institutions | 48.9 (%) |
| Shares Short | 9,630 (K) |
| Shares Short P.Month | 8,670 (K) |
| EPS | 2.23 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 18.75 |
| Profit Margin | 7.4 % |
| Operating Margin | 10.5 % |
| Return on Assets (ttm) | 4.6 % |
| Return on Equity (ttm) | 12.5 % |
| Qtrly Rev. Growth | 25.6 % |
| Gross Profit (p.s.) | 4.66 |
| Sales Per Share | 30.02 |
| EBITDA (p.s.) | 5.31 |
| Qtrly Earnings Growth | 218.1 % |
| Operating Cash Flow | 1,190 (M) |
| Levered Free Cash Flow | -379 (M) |
| PE Ratio | 20.79 |
| PEG Ratio | 0.7 |
| Price to Book value | 2.47 |
| Price to Sales | 1.54 |
| Price to Cash Flow | 9.68 |
| Dividend | 0.07 |
| Forward Dividend | 0 |
| Dividend Yield | 0.1% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |
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