37.28  -2.185 (-5.54%)		09-14 13:48
Open: 37.88 High: 37.88 Volume: 3,692,794		Pre. Close: 39.465 Low: 36.6801 Market Cap: 81,972(M)

Short term
Mid term
Targets	6-month :	45.66	1-year :	48.32
Resists	First :	39.09	Second :	41.36
Pivot price	38.07
Supports	First :	35.41	Second :	29.46
MAs	MA(5) :	39.5	MA(20) :	37.8
	MA(100) :	37.01	MA(250) :	25.4
MACD	MACD :	0.3	Signal :	0.1
%K %D	K(14,3) :	54.7	D(3) :	73
RSI	RSI(14): 46.6
52-week	High :	45.27	Low :	10.82

Price has closed below its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BULLISH in mid-long term.
[ ASX ] has closed above bottom band by 33.7%. Bollinger Bands are 34% narrower than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.

If tomorrow:	Open lower	Open higher
High:	39.9 - 40.12	40.12 - 40.3
Low:	38.54 - 38.81	38.81 - 39.04
Close:	39.06 - 39.48	39.48 - 39.82

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

Thu, 10 Sep 2026
Can Strong LEAP Momentum Boost ASE Technology's Long-Term Growth? - TradingView

Thu, 10 Sep 2026
ASE Technology Holding Posts Strong August 2026 Revenue Surge Led by ATM Business - The Globe and Mail

Wed, 09 Sep 2026
ASE Technology Surges 16% in 3 Months: Time to Hold or Fold the Stock? - TradingView

Wed, 09 Sep 2026
Tsai Chi-Wen adds to ASE Technology (NYSE: ASX) stake with 334K-share grant - Stock Titan

Wed, 09 Sep 2026
30,000-share award lifts ASE (NYSE: ASX) insider's stake - Stock Titan

Wed, 09 Sep 2026
ASE Technology (ASX) awards 40,000 shares to ISE Labs CEO - Stock Titan

Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.	Underperform
Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).	Underperform
Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.	Neutral
Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.	Outperform
Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.	Outperform
Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.	Underperform

Exchange: NYSE
Sector: Technology
Industry: Semiconductors
Shares Out	2,600 (M)
Shares Float	1,630 (M)
Held by Insiders	0 (%)
Held by Institutions	7.3 (%)
Shares Short	8,740 (K)
Shares Short P.Month	9,530 (K)

EPS	0.81
EPS Est Next Qtrly	0
EPS Est This Year	0
EPS Est Next Year	0
Book Value (p.s.)	5.57
Profit Margin	8.5 %
Operating Margin	11 %
Return on Assets (ttm)	4.7 %
Return on Equity (ttm)	17 %
Qtrly Rev. Growth	26.7 %
Gross Profit (p.s.)	53.29
Sales Per Share	273.54
EBITDA (p.s.)	53.84
Qtrly Earnings Growth	171.1 %
Operating Cash Flow	168,830 (M)
Levered Free Cash Flow	-104,670 (M)

PE Ratio	45.35
PEG Ratio	4.9
Price to Book value	6.67
Price to Sales	0.13
Price to Cash Flow	0.57

Dividend	0.41
Forward Dividend	0
Dividend Yield	1.1%
Dividend Pay Date	Invalid DateTime.
Ex-Dividend Date	Invalid DateTime.