| 38.15 -0.03 (-0.08%) | 07-26 16:00 | |||||||||||||
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| Short term |  |
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| Mid term | |
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| Targets | 6-month : | 48.83 | 1-year : | 52.39 |
| Resists | First : | 41.8 | Second : | 44.86 |
| Pivot price | 41.18  |
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| Supports | First : | 36.86 | Second : | 30.67 |
| MAs | MA(5) : | 39.51 |
MA(20) : | 40.92 |
| MA(100) : | 34.52  |
MA(250) : | 30.28 |
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| MACD | MACD : | 0.5 |
Signal : | 1.2 |
| %K %D | K(14,3) : | 8.2 |
D(3) : | 14.6 |
| RSI | RSI(14): 44.5 |
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| 52-week | High : | 44.86 | Low : | 17.57 |
Price has closed below its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BULLISH in mid-long term.[ AMKR ] has closed above bottom band by 7.5%. Bollinger Bands are 36.4% wider than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.
| If tomorrow: | Open lower | Open higher |
| High: | 39.21 - 39.48 | 39.48 - 39.69 |
| Low: | 36.96 - 37.33 | 37.33 - 37.61 |
| Close: | 37.64 - 38.14 | 38.14 - 38.52 |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Fri, 26 Jul 2024
What's Going On With Amkor Technology Stock Today? - Benzinga
Fri, 26 Jul 2024
Amkor Technology, Inc. (NASDAQ:AMKR) Shares Acquired by Sei Investments Co. - MarketBeat
Fri, 26 Jul 2024
Amkor Technology, Inc. Expected to Earn FY2026 Earnings of $2.80 Per Share (NASDAQ:AMKR) - MarketBeat
Fri, 26 Jul 2024
What's in the Offing for Amkor (AMKR) This Earnings Season? - Yahoo Finance
Fri, 26 Jul 2024
Amkor Technology, Inc. (NASDAQ:AMKR) Short Interest Update - Defense World
Fri, 26 Jul 2024
Sei Investments Co. Has $2.41 Million Stock Position in Amkor Technology, Inc. (NASDAQ:AMKR) - Defense World
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Neutral |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Underperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Neutral |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Neutral |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Underperform |
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Exchange:
NASDAQ
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 246 (M) |
| Shares Float | 123 (M) |
| Held by Insiders | 54.7 (%) |
| Held by Institutions | 43.9 (%) |
| Shares Short | 4,680 (K) |
| Shares Short P.Month | 4,810 (K) |
| EPS | 1.51 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 16.23 |
| Profit Margin | 5.8 % |
| Operating Margin | 5.3 % |
| Return on Assets (ttm) | 4.4 % |
| Return on Equity (ttm) | 9.7 % |
| Qtrly Rev. Growth | -7.2 % |
| Gross Profit (p.s.) | 0 |
| Sales Per Share | 25.99 |
| EBITDA (p.s.) | 4.42 |
| Qtrly Earnings Growth | 33 % |
| Operating Cash Flow | 1,260 (M) |
| Levered Free Cash Flow | 368 (M) |
| PE Ratio | 25.09 |
| PEG Ratio | -2.2 |
| Price to Book value | 2.34 |
| Price to Sales | 1.46 |
| Price to Cash Flow | 7.45 |
| Dividend | 0.07 |
| Forward Dividend | 0 |
| Dividend Yield | 0.2% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |
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