| 44.45 -0.69 (-1.53%) | 03-27 16:00 | |||||||||||||
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| Short term |  |
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| Mid term | |
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| Targets | 6-month : | 55.11 | 1-year : | 60.15 |
| Resists | First : | 47.19 | Second : | 51.5 |
| Pivot price | 45.53  |
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| Supports | First : | 40.22 | Second : | 33.46 |
| MAs | MA(5) : | 47.18  |
MA(20) : | 45.36 |
| MA(100) : | 43.97 |
MA(250) : | 31.18 |
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| MACD | MACD : | -0.1 |
Signal : | -0.4 |
| %K %D | K(14,3) : | 55.7 |
D(3) : | 72 |
| RSI | RSI(14): 45.6 |
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| 52-week | High : | 57.09 | Low : | 13.89 |
Price has closed below its short-term moving average. Short-term moving average is currently below mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is BEARISH in short-term; and NEUTRAL in mid-long term.[ AMKR ] has closed above bottom band by 38.8%. Bollinger Bands are 16.6% narrower than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.
| If tomorrow: | Open lower | Open higher |
| High: | 46.27 - 46.55 | 46.55 - 46.75 |
| Low: | 43.57 - 43.93 | 43.93 - 44.19 |
| Close: | 43.98 - 44.51 | 44.51 - 44.9 |
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Sat, 28 Mar 2026
AMKOR TECHNOLOGY INC (NASDAQ:AMKR) Shows High-Growth Momentum and Technical Breakout Setup - chartmill.com
Fri, 27 Mar 2026
Broader analyst sentiment mixed on Amkor Technology (AMKR) despite price target raises - MSN
Fri, 27 Mar 2026
SG Americas Securities LLC Increases Holdings in Amkor Technology, Inc. $AMKR - MarketBeat
Thu, 26 Mar 2026
Amkor Technology (AMKR) Sees a More Significant Dip Than Broader Market: Some Facts to Know - Yahoo Finance Singapore
Thu, 26 Mar 2026
Amkor Technology (AMKR): Vanguard reports 0 shares after internal realignment - Stock Titan
Thu, 26 Mar 2026
Amkor Technology (NASDAQ:AMKR) Shares Down 5.1% - Time to Sell? - MarketBeat
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Neutral |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Underperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Outperform |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Neutral |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Underperform |
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Exchange:
NASDAQ
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 247 (M) |
| Shares Float | 122 (M) |
| Held by Insiders | 49.8 (%) |
| Held by Institutions | 46.9 (%) |
| Shares Short | 8,590 (K) |
| Shares Short P.Month | 9,720 (K) |
| EPS | 1.5 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 18.07 |
| Profit Margin | 5.5 % |
| Operating Margin | 9.7 % |
| Return on Assets (ttm) | 3.8 % |
| Return on Equity (ttm) | 8.6 % |
| Qtrly Rev. Growth | 15.8 % |
| Gross Profit (p.s.) | 3.79 |
| Sales Per Share | 27.13 |
| EBITDA (p.s.) | 4.48 |
| Qtrly Earnings Growth | 61 % |
| Operating Cash Flow | 1,100 (M) |
| Levered Free Cash Flow | -115 (M) |
| PE Ratio | 29.63 |
| PEG Ratio | 0 |
| Price to Book value | 2.45 |
| Price to Sales | 1.63 |
| Price to Cash Flow | 9.99 |
| Dividend | 0.07 |
| Forward Dividend | 0 |
| Dividend Yield | 0.1% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |
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