Stock Symbol:   

Stoxline Mobile
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Amkor Technology, Inc. (AMKR)

22.33   -0.1 (-0.45%) 09-21 12:11
Open: 22.13 Pre. Close: 22.43
High: 22.6 Low: 22.0808
Volume: 354,927 Market Cap: 5,488(M)

Technical analysis

as of: 2023-09-21 11:44:38 AM
Short-term rate:       
Stoxline posted a SELL today, downgraded from higher rating. Downward movement to be expected.
Mid-term rate:       
Target: Six months: 30.31     One year: 33.35
Support: Support1: 21.72    Support2: 18.07
Resistance: Resistance1: 25.95    Resistance2: 28.55
Pivot: 23.98
Moving Average: MA(5): 22.52     MA(20): 24.76
MA(100): 25.84     MA(250): 25.16
MACD: MACD(12,26): -1.3     Signal(9): -1.1
Stochastic oscillator: %K(14,3): 11.4     %D(3): 12.5
RSI: RSI(14): 33.5
52-week: High: 31.37  Low: 16.12
Average Vol(K): 3-Month: 1,082 (K)  10-Days: 1,762 (K)

Price, moving averages and Bollinger Bands

Price has closed below its short-term moving average. Short-term moving average is currently below mid-term; and below long-term moving average. From the relationship between price and moving averages: This stock is BEARISH in short-term; and NEUTRAL in mid-long term.
[ AMKR ] has closed above bottom band by 33.6%. Bollinger Bands are 112.3% wider than normal. The large width of the bands suggest high volatility as compared to its normal range. The bands have been in this wide range for 10 days. This is a sign that the current trend might continue.

Stock Price Prediction

Update at 5:00pm EST
If tomorrow: Open lower Open higher
High: 23.05 - 23.19 23.19 - 23.29
Low: 22.09 - 22.27 22.27 - 22.39
Close: 22.2 - 22.46 22.46 - 22.64

Company Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Headline News

Wed, 20 Sep 2023
1 Top Semiconductor Stock That's Too Cheap to Ignore - Nasdaq

Mon, 18 Sep 2023
Should Semiconductors Stock Amkor Technology, Inc. (AMKR) Be in Your Portfolio Monday? - InvestorsObserver

Mon, 18 Sep 2023
Amkor Technology Joins the PHLX Semiconductor Sector Index (SOX) - Yahoo Finance

Sun, 17 Sep 2023
Short Interest in Amkor Technology, Inc. (NASDAQ:AMKR) Expands ... - MarketBeat

Thu, 07 Sep 2023
ExodusPoint Capital Management LP Purchases New Shares in ... - MarketBeat

Thu, 07 Sep 2023
S&P 500 Futures Decline in Premarket Trading; Amkor Technology, Rollins Inc Lag - Barron's

Financial Analysis

Price to Book Value: Outperform
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Price to Earnings: Outperform
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Discounted cash flow: Outperform
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Return on Assets: Neutral
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Return on Equity: Neutral
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Debt to Equity: Outperform
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Free Technical Analysis Charts

Stock Basics & Statistics

Exchange:  NASDAQ
Sector:  Technology
Industry:  Semiconductors
Shares Out. 246 (M)
Shares Float 78 (M)
% Held by Insiders 59.5 (%)
% Held by Institutions 38.8 (%)
Shares Short 3,060 (K)
Shares Short P.Month 3,390 (K)

Stock Financials

EPS 2.34
EPS Est Next Qtl 0
EPS Est This Year 0
EPS Est Next Year 0
Book Value (p.s.) 15.18
Profit Margin (%) 8.3
Operating Margin (%) 9.9
Return on Assets (ttm) 6.6
Return on Equity (ttm) 16.6
Qtrly Rev. Growth -3.1
Gross Profit (p.s.) 5.41
Sales Per Share 28.17
EBITDA (p.s.) 5.37
Qtrly Earnings Growth -49
Operating Cash Flow 1,060 (M)
Levered Free Cash Flow 5 (M)

Stock Valuations

PE Ratio 9.53
PEG Ratio -1.7
Price to Book value 1.47
Price to Sales 0.79
Price to Cash Flow 5.19

Stock Dividends

Dividend 0.07
Forward Dividend 0
Dividend Yield 0.3%
Dividend Pay Date Invalid DateTime.
Ex-Dividend Date Invalid DateTime.
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