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Amkor Technology, Inc. (AMKR)
30.25  1.16 (3.99%)    10-04 11:19
Open: 30.69
High: 31.07
Volume: 825,128
  
Pre. Close: 29.09
Low: 30.1614
Market Cap: 7,453(M)
Technical analysis
2024-10-04 10:45:59 AM
Short term     
Mid term     
Targets 6-month :  36.75 1-year :  39.13
Resists First :  31.47 Second :  33.5
Pivot price 30.5
Supports First :  28.17 Second :  23.43
MAs MA(5) :  29.75 MA(20) :  30.28
MA(100) :  34.12 MA(250) :  31.44
MACD MACD :  -0.5 Signal :  -0.5
%K %D K(14,3) :  19.2 D(3) :  20
RSI RSI(14): 47.5
52-week High :  44.86 Low :  17.57
Price, MAs and Bollinger Bands

Price has closed above its short-term moving average. Short-term moving average is currently below mid-term; and below long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BEARISH in mid-long term.
[ AMKR ] has closed above bottom band by 42.2%. Bollinger Bands are 54.6% narrower than normal. The narrow width of the bands suggests low volatility as compared to its normal range. The bands have been in this narrow range for 9 bars. This is a sign that the market may be about to initiate a new trend.

Stock Price Prediction
If tomorrow: Open lower Open higher
High: 29.89 - 30.05 30.05 - 30.19
Low: 28.5 - 28.74 28.74 - 28.93
Close: 28.75 - 29.09 29.09 - 29.37
Company Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Headline News

Fri, 04 Oct 2024
Investors Purchase Large Volume of Put Options on Amkor Technology (NASDAQ:AMKR) - MarketBeat

Fri, 04 Oct 2024
S&P 500 Futures Rise in Premarket Trading; Summit Therapeutics, Axalta Coating Systems Lead - Barron's

Fri, 04 Oct 2024
Mackenzie Financial Corp Buys 17,895 Shares of Amkor Technology, Inc. (NASDAQ:AMKR) - MarketBeat

Thu, 03 Oct 2024
Amkor Technology (AMKR) and TSMC (TSM) to Expand Partnership and Collaborate on Advanced Packaging in Arizona - StreetInsider.com

Thu, 03 Oct 2024
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona - StockTitan

Tue, 01 Oct 2024
Will Amkor Technology, Inc. (AMKR) Thrive as AI Drives Semiconductor Growth? - Yahoo Finance

Financial Analysis
Price to Book Value:
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Neutral
Price to Earnings:
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Underperform
Discounted cash flow:
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Neutral
Return on Assets:
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Neutral
Return on Equity:
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Neutral
Debt to Equity:
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Underperform
Stock Basics & Statistics
Exchange:
NASDAQ
Sector:
Technology
Industry:
Semiconductors
Shares Out 246 (M)
Shares Float 140 (M)
Held by Insiders 55.5 (%)
Held by Institutions 44 (%)
Shares Short 3,240 (K)
Shares Short P.Month 3,070 (K)
Stock Financials
EPS 1.51
EPS Est Next Qtrly 0
EPS Est This Year 0
EPS Est Next Year 0
Book Value (p.s.) 16.44
Profit Margin 5.8 %
Operating Margin 5.5 %
Return on Assets (ttm) 4.4 %
Return on Equity (ttm) 9.6 %
Qtrly Rev. Growth 0.2 %
Gross Profit (p.s.) 0
Sales Per Share 25.97
EBITDA (p.s.) 4.42
Qtrly Earnings Growth 3.7 %
Operating Cash Flow 1,230 (M)
Levered Free Cash Flow 327 (M)
Stock Valuations
PE Ratio 19.91
PEG Ratio -1.9
Price to Book value 1.84
Price to Sales 1.16
Price to Cash Flow 6.06
Stock Dividends
Dividend 0
Forward Dividend 0
Dividend Yield 0%
Dividend Pay Date Invalid DateTime.
Ex-Dividend Date Invalid DateTime.

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