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Stoxline Mobile
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ASE Technology Holding Co., Ltd. (ASX)

7.745   0.215 (2.86%) 03-22 11:55
Open: 7.62 Pre. Close: 7.53
High: 7.75 Low: 7.59
Volume: 1,726,223 Market Cap: 16,616(M)

Technical analysis

as of: 2023-03-22 11:14:18 AM
Stoxline posted a BUY today, upgraded from lower rating. Upward movement to be expected.
Target: Six months: 9.02     One year: 10.54
Support: Support1: 7.22    Support2: 6.9
Resistance: Resistance1: 7.73    Resistance2: 9.02
Pivot: 7.45
Moving Average: MA(5): 7.6     MA(20): 7.39
MA(100): 6.77     MA(250): 6.32
MACD: MACD(12,26): 0.1     Signal(9): 0
Stochastic oscillator: %K(14,3): 85.5     %D(3): 81.7
RSI: RSI(14): 58.8
52-week: High: 7.73  Low: 4.44
Average Vol(K): 3-Month: 5,805 (K)  10-Days: 7,137 (K)

Price, moving averages and Bollinger Bands

Price has closed above its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is BULLISH in short-term; and BULLISH in mid-long term.
[ ASX ] has closed below upper band by 4.7%. Bollinger Bands are 35.4% narrower than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.

Stock Price Prediction

Update at 5:00pm EST
If tomorrow: Open lower Open higher
High: 7.6 - 7.64 7.64 - 7.67
Low: 7.32 - 7.37 7.37 - 7.41
Close: 7.46 - 7.54 7.54 - 7.6

Company Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Headline News

Mon, 20 Mar 2023
ASE Technology Holding Co., Ltd - Consensus Indicates Potential ... - DirectorsTalk Interviews

Sat, 18 Mar 2023
Research on ASE Technology (NYSE:ASX) began at - Best Stocks

Thu, 16 Mar 2023
ASE Technology (NYSE:ASX) Research Coverage Started at ... - MarketBeat

Wed, 15 Mar 2023
Is ASE Technology Holding Co Ltd (ASX) Stock a Smart Value Wednesday? - InvestorsObserver

Tue, 14 Mar 2023
ASE Drives Latency and Bandwidth Innovation with VIPack ... - Business Wire

Wed, 08 Mar 2023
ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues* - Yahoo Finance

Financial Analysis

Price to Book Value: Outperform
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Price to Earnings: Outperform
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Discounted cash flow: Outperform
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Return on Assets: Neutral
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Return on Equity: Neutral
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Debt to Equity: Outperform
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Free Technical Analysis Charts

Stock Basics & Statistics

Exchange:  NYSE
Sector:  Technology
Industry:  Semiconductors
Shares Out. 2,150 (M)
Shares Float 1,510 (M)
% Held by Insiders 0 (%)
% Held by Institutions 7.5 (%)
Shares Short 5,790 (K)
Shares Short P.Month 5,920 (K)

Stock Financials

EPS 0.89
EPS Est Next Qtl 0.15
EPS Est This Year 0.43
EPS Est Next Year 0.5
Book Value (p.s.) 140.41
Profit Margin (%) 9.2
Operating Margin (%) 11.9
Return on Assets (ttm) 7.2
Return on Equity (ttm) 21.9
Qtrly Rev. Growth 2.5
Gross Profit (p.s.) 62.75
Sales Per Share 312.03
EBITDA (p.s.) 63.08
Qtrly Earnings Growth -48.8
Operating Cash Flow 111,000 (M)
Levered Free Cash Flow 24,820 (M)

Stock Valuations

PE Ratio 8.57
PEG Ratio -2.8
Price to Book value 0.05
Price to Sales 0.02
Price to Cash Flow 0.14

Stock Dividends

Dividend 0.47
Forward Dividend 0
Dividend Yield 6.2%
Dividend Pay Date 2021-10-06
Ex-Dividend Date 2021-09-02
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