| 10.05 -0.3 (-2.9%) | 04-19 16:00 | |||||||||||||
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| Short term |  |
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| Mid term | |
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| Targets | 6-month : | 12.79  |
1-year : | 13.46 |
| Resists | First : | 10.95 |
Second : | 11.52 |
| Pivot price | 10.82 |
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| Supports | First : | 10.02 |
Second : | 8.33 |
| MAs | MA(5) : | 10.51 |
MA(20) : | 10.88 |
| MA(100) : | 9.75  |
MA(250) : | 8.57 |
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| MACD | MACD : | -0.1 |
Signal : | 0 |
| %K %D | K(14,3) : | 6 |
D(3) : | 12 |
| RSI | RSI(14): 35.6 |
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| 52-week | High : | 11.68 | Low : | 6.69 |
Price has closed below its short-term moving average. Short-term moving average is currently below mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is BEARISH in short-term; and NEUTRAL in mid-long term.[ ASX ] has closed below the lower bollinger band by 16.0%. If price is in a downtrend band; this downward trend might continue. However a short term pullback inside the band is likely. Bollinger Bands are 9.5% wider than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.
| If tomorrow: | Open lower | Open higher |
| High: | 10.4 - 10.5 | 10.5 - 10.56 |
| Low: | 9.81 - 9.94 | 9.94 - 10.02 |
| Close: | 9.9 - 10.11 | 10.11 - 10.24 |
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
Tue, 16 Apr 2024
ASE Technology Hldg (ASX) Dips More Than Broader Markets: What You Should Know - Yahoo New Zealand News
Tue, 16 Apr 2024
STM: 3 Chip Stocks With Massive Potential for Investment Opportunity - StockNews.com
Tue, 09 Apr 2024
ASE Technology's Mixed Financial Performance - TipRanks.com - TipRanks
Tue, 09 Apr 2024
ASE Technology March revenue drops 3.4% Y/Y to $1.45B - Seeking Alpha
Tue, 09 Apr 2024
ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues* By Investing.com - Investing.com Canada
Mon, 08 Apr 2024
ASE Technology Files Annual Financial Report - TipRanks.com - TipRanks
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Outperform |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Outperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Outperform |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Outperform |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Outperform |
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Exchange:
NYSE
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 2,160 (M) |
| Shares Float | 3,010 (M) |
| Held by Insiders | 0 (%) |
| Held by Institutions | 6.9 (%) |
| Shares Short | 11,320 (K) |
| Shares Short P.Month | 8,710 (K) |
| EPS | 0.5 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 69.05 |
| Profit Margin | 5.4 % |
| Operating Margin | 7.3 % |
| Return on Assets (ttm) | 3.6 % |
| Return on Equity (ttm) | 10.5 % |
| Qtrly Rev. Growth | -9.5 % |
| Gross Profit (p.s.) | 0 |
| Sales Per Share | 269.4 |
| EBITDA (p.s.) | 44.36 |
| Qtrly Earnings Growth | -40.5 % |
| Operating Cash Flow | 114,420 (M) |
| Levered Free Cash Flow | 46,560 (M) |
| PE Ratio | 20.1 |
| PEG Ratio | 0.5 |
| Price to Book value | 0.14 |
| Price to Sales | 0.03 |
| Price to Cash Flow | 0.18 |
| Dividend | 0 |
| Forward Dividend | 0 |
| Dividend Yield | 0% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |
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