| 10.01 0.2 (2.04%) | 12-11 16:00 | |||||||||||||
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| Short term |   |
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| Mid term |  |
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| Targets | 6-month : | 12.01 | 1-year : | 14.03 |
| Resists | First : | 10.28 | Second : | 12.01 |
| Pivot price | 9.88 |
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| Supports | First : | 9.68 | Second : | 9.31 |
| MAs | MA(5) : | 10.01 |
MA(20) : | 9.83 |
| MA(100) : | 9.81  |
MA(250) : | 10.15 |
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| MACD | MACD : | 0 |
Signal : | 0 |
| %K %D | K(14,3) : | 68.7 |
D(3) : | 77.9 |
| RSI | RSI(14): 52.7 |
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| 52-week | High : | 12.85 | Low : | 8.1 |
Price has closed below its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BULLISH in mid-long term.[ ASX ] has closed below upper band by 32.1%. Bollinger Bands are 52.7% narrower than normal. The narrow width of the bands suggests low volatility as compared to its normal range. The bands have been in this narrow range for 17 bars. This is a sign that the market may be about to initiate a new trend.
| If tomorrow: | Open lower | Open higher |
| High: | 10.09 - 10.15 | 10.15 - 10.2 |
| Low: | 9.69 - 9.76 | 9.76 - 9.83 |
| Close: | 9.9 - 10.01 | 10.01 - 10.11 |
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
Wed, 11 Dec 2024
TT International Asset Management LTD Has $20.14 Million Holdings in ASE Technology Holding Co., Ltd. (NYSE:ASX) - MarketBeat
Sun, 08 Dec 2024
201,720 Shares in ASE Technology Holding Co., Ltd. (NYSE:ASX) Acquired by XTX Topco Ltd - MarketBeat
Thu, 14 Nov 2024
Lightmatter and ASE Partner to Bring 3D Photonics to Market - Business Wire
Wed, 13 Nov 2024
ASE Technology (ASX) Shares Rise as October Revenue Hits 23-Mont - GuruFocus.com
Thu, 07 Nov 2024
ASE Technology Holding Co Ltd (ASX) Trading 3.55% Higher on Nov 7 - GuruFocus.com
Sat, 02 Nov 2024
ASE Technology Holding Co., Ltd. (NYSE:ASX) Q3 2024 Earnings Call Transcript - Insider Monkey
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Underperform |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Underperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Outperform |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Outperform |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Underperform |
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Exchange:
NYSE
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 2,170 (M) |
| Shares Float | 3,100 (M) |
| Held by Insiders | 0 (%) |
| Held by Institutions | 7.5 (%) |
| Shares Short | 11,000 (K) |
| Shares Short P.Month | 10,240 (K) |
| EPS | 0.5 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 71.3 |
| Profit Margin | 5.4 % |
| Operating Margin | 7.1 % |
| Return on Assets (ttm) | 3.5 % |
| Return on Equity (ttm) | 10.5 % |
| Qtrly Rev. Growth | 3.9 % |
| Gross Profit (p.s.) | 0 |
| Sales Per Share | 273.6 |
| EBITDA (p.s.) | 44.34 |
| Qtrly Earnings Growth | 8.3 % |
| Operating Cash Flow | 102,370 (M) |
| Levered Free Cash Flow | 47,400 (M) |
| PE Ratio | 20.02 |
| PEG Ratio | 0 |
| Price to Book value | 0.14 |
| Price to Sales | 0.03 |
| Price to Cash Flow | 0.21 |
| Dividend | 0 |
| Forward Dividend | 0 |
| Dividend Yield | 0% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |
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