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ASE Technology Holding Co., Ltd. (ASX)
11.11  0.01 (0.09%)    07-23 16:00
Open: 11.2
High: 11.285
Volume: 5,953,149
  
Pre. Close: 11.1
Low: 11.075
Market Cap: 23,995(M)
Technical analysis
2024-07-23 4:50:31 PM
Short term     
Mid term     
Targets 6-month :  14.14 1-year :  15.02
Resists First :  12.11 Second :  12.85
Pivot price 11.56
Supports First :  10.89 Second :  9.06
MAs MA(5) :  11.17 MA(20) :  11.53
MA(100) :  10.96 MA(250) :  9.41
MACD MACD :  -0.1 Signal :  0.1
%K %D K(14,3) :  9 D(3) :  12.6
RSI RSI(14): 43.7
52-week High :  12.85 Low :  7.19
Price, MAs and Bollinger Bands

Price has closed below its short-term moving average. Short-term moving average is currently below mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is BEARISH in short-term; and NEUTRAL in mid-long term.
[ ASX ] has closed above bottom band by 24.0%. Bollinger Bands are 48.6% wider than normal. The large width of the bands suggest high volatility as compared to its normal range. The bands have been in this wide range for 2 days. This is a sign that the current trend might continue.

Stock Price Prediction
If tomorrow: Open lower Open higher
High: 11.3 - 11.36 11.36 - 11.41
Low: 10.94 - 11 11 - 11.06
Close: 11.01 - 11.11 11.11 - 11.2
Company Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Headline News

Tue, 23 Jul 2024
O Shaughnessy Asset Management LLC Acquires 137,164 Shares of ASE Technology Holding Co., Ltd. (NYSE:ASX) - MarketBeat

Mon, 22 Jul 2024
ASE Technology Holding Co., Ltd. (NYSE:ASX) Shares Sold by Sei Investments Co. - MarketBeat

Mon, 22 Jul 2024
Sei Investments Co. Decreases Position in ASE Technology Holding Co., Ltd. (NYSE:ASX) - Defense World

Mon, 22 Jul 2024
Janney Montgomery Scott LLC Raises Stock Position in ASE Technology Holding Co., Ltd. (NYSE:ASX) - Defense World

Sun, 21 Jul 2024
ASE Technology Holding Co., Ltd. (NYSE:ASX) Shares Acquired by Acadian Asset Management LLC - MarketBeat

Sun, 21 Jul 2024
Bleakley Financial Group LLC Decreases Stake in ASE Technology Holding Co., Ltd. (NYSE:ASX) - Defense World

Financial Analysis
Price to Book Value:
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Outperform
Price to Earnings:
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Underperform
Discounted cash flow:
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Neutral
Return on Assets:
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Neutral
Return on Equity:
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Neutral
Debt to Equity:
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Outperform
Stock Basics & Statistics
Exchange:
NYSE
Sector:
Technology
Industry:
Semiconductors
Shares Out 2,160 (M)
Shares Float 3,020 (M)
Held by Insiders 0 (%)
Held by Institutions 7.8 (%)
Shares Short 7,630 (K)
Shares Short P.Month 9,970 (K)
Stock Financials
EPS 0.49
EPS Est Next Qtrly 0
EPS Est This Year 0
EPS Est Next Year 0
Book Value (p.s.) 67.36
Profit Margin 5.4 %
Operating Margin 5.6 %
Return on Assets (ttm) 3.7 %
Return on Equity (ttm) 11.1 %
Qtrly Rev. Growth 1.5 %
Gross Profit (p.s.) 0
Sales Per Share 270.29
EBITDA (p.s.) 44.24
Qtrly Earnings Growth -1.9 %
Operating Cash Flow 100,360 (M)
Levered Free Cash Flow 23,850 (M)
Stock Valuations
PE Ratio 22.67
PEG Ratio 0.6
Price to Book value 0.16
Price to Sales 0.04
Price to Cash Flow 0.23
Stock Dividends
Dividend 0.31
Forward Dividend 0
Dividend Yield 2.8%
Dividend Pay Date Invalid DateTime.
Ex-Dividend Date Invalid DateTime.

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