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Stoxline Mobile
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ASE Technology Holding Co., Ltd. (ASX)

6.38   -0.11 (-1.69%) 11-25 13:00
Open: 6.5 Pre. Close: 6.49
High: 6.51 Low: 6.38
Volume: 2,765,019 Market Cap: 13,678(M)

Technical analysis

as of: 2022-11-25 1:55:16 PM
Stoxline posted a SELL today, downgraded from higher rating. Downward movement to be expected.
Target: Six months: 7.63     One year: 8.92
Support: Support1: 5.51    Support2: 4.88
Resistance: Resistance1: 6.53    Resistance2: 7.63
Pivot: 6.09
Moving Average: MA(5): 6.38     MA(20): 5.84
MA(100): 5.58     MA(250): 6.44
MACD: MACD(12,26): 0.3     Signal(9): 0.2
Stochastic oscillator: %K(14,3): 94.4     %D(3): 93.9
RSI: RSI(14): 65.4
52-week: High: 8.14  Low: 4.44
Average Vol(K): 3-Month: 9,581 (K)  10-Days: 8,873 (K)

Price, moving averages and Bollinger Bands

Price has closed below its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and NEUTRAL in mid-long term.
[ ASX ] has closed below upper band by 29.8%. Bollinger Bands are 41.2% wider than normal. The large width of the bands suggest high volatility as compared to its normal range. The bands have been in this wide range for 9 days. This is a sign that the current trend might continue.

Stock Price Prediction

Update at 5:00pm EST
If tomorrow: Open lower Open higher
High: 6.55 - 6.57 6.57 - 6.59
Low: 6.36 - 6.39 6.39 - 6.41
Close: 6.44 - 6.49 6.49 - 6.53

Company Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Headline News

Sat, 26 Nov 2022
Insider Buying: The Advanced Braking Technology Limited (ASX:ABV) Non-Executive Director Just Bought 3.1% More Shares - Simply Wall St

Sat, 26 Nov 2022
Skin in the game: The ASX share in my portfolio I'm most excited about - The Motley Fool Australia

Fri, 25 Nov 2022
Austral Gold sells Pinguino project in Argentina to ASX-listed E2 Metals - MINING.COM -

Fri, 25 Nov 2022
A Magnetic Resources NL (ASX:MAU) insider increased their holdings by 5.7% last year - Yahoo Finance

Thu, 24 Nov 2022
Brokers name 3 ASX shares to buy today - The Motley Fool Australia

Thu, 24 Nov 2022
5 of the craziest things making news on the ASX this week - The Motley Fool Australia

Financial Analysis

Price to Book Value: Outperform
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Price to Earnings: Outperform
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Discounted cash flow: Outperform
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Return on Assets: Neutral
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Return on Equity: Neutral
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Debt to Equity: Outperform
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Free Technical Analysis Charts

Stock Basics & Statistics

Exchange:  NYSE
Sector:  Technology
Industry:  Semiconductors
Shares Out. 2,140 (M)
Shares Float 1,640 (M)
% Held by Insiders 0 (%)
% Held by Institutions 7 (%)
Shares Short 8,690 (K)
Shares Short P.Month 7,230 (K)

Stock Financials

EPS 1.07
EPS Est Next Qtl 0.15
EPS Est This Year 0.43
EPS Est Next Year 0.5
Book Value (p.s.) 134.38
Profit Margin (%) 11.6
Operating Margin (%) 12
Return on Assets (ttm) 7.2
Return on Equity (ttm) 28.8
Qtrly Rev. Growth 25.2
Gross Profit (p.s.) 51.57
Sales Per Share 311.39
EBITDA (p.s.) 61.94
Qtrly Earnings Growth 22.3
Operating Cash Flow 93,740 (M)
Levered Free Cash Flow 6,570 (M)

Stock Valuations

PE Ratio 5.96
PEG Ratio 0.2
Price to Book value 0.04
Price to Sales 0.02
Price to Cash Flow 0.14

Stock Dividends

Dividend 0.47
Forward Dividend 0
Dividend Yield 7.5%
Dividend Pay Date 2021-10-06
Ex-Dividend Date 2021-09-02
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