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Stoxline Mobile
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ASE Technology Holding Co., Ltd. (ASX)

7.52   0.03 (0.4%) 09-29 16:00
Open: 7.56 Pre. Close: 7.49
High: 7.61 Low: 7.49
Volume: 3,973,975 Market Cap: 16,181(M)

Technical analysis

as of: 2023-09-29 4:25:57 PM
Short-term rate:       
Stoxline posted a BUY today, same as yesterday. Upward movement continues.
Mid-term rate:       
Target: Six months: 9.32     One year: 9.85
Support: Support1: 7.25    Support2: 6.03
Resistance: Resistance1: 7.98    Resistance2: 8.43
Pivot: 7.58
Moving Average: MA(5): 7.43     MA(20): 7.7
MA(100): 7.86     MA(250): 7.15
MACD: MACD(12,26): -0.2     Signal(9): -0.1
Stochastic oscillator: %K(14,3): 29.7     %D(3): 19.3
RSI: RSI(14): 45.1
52-week: High: 9.02  Low: 4.44
Average Vol(K): 3-Month: 5,039 (K)  10-Days: 4,064 (K)

Price, moving averages and Bollinger Bands

Price has closed above its short-term moving average. Short-term moving average is currently below mid-term; and below long-term moving average. From the relationship between price and moving averages: This stock is NEUTRAL in short-term; and BEARISH in mid-long term.
[ ASX ] has closed above bottom band by 40.0%. Bollinger Bands are 45.3% narrower than normal. The narrow width of the bands suggests low volatility as compared to its normal range. The bands have been in this narrow range for 1 bars. This is a sign that the market may be about to initiate a new trend.

Stock Price Prediction

Update at 5:00pm EST
If tomorrow: Open lower Open higher
High: 7.62 - 7.65 7.65 - 7.68
Low: 7.41 - 7.45 7.45 - 7.48
Close: 7.46 - 7.52 7.52 - 7.57

Company Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Headline News

Sun, 01 Oct 2023
FDx Advisors Inc. Shows Confidence in ASE Technology Holding ... - Best Stocks

Mon, 25 Sep 2023
USI's Echo Cancellation and Noise Reduction Audio Solution to ... - PR Newswire

Fri, 22 Sep 2023
Andrew Percoco Raises Price Target for First Solar but Falls Short of ... - Best Stocks

Thu, 21 Sep 2023
ASE Technology Holding (ASX) Shares Cross Below 200 DMA - Nasdaq

Thu, 21 Sep 2023
Renowned Analyst Predicts Surge in Value for Enovix Stock - Best Stocks

Wed, 20 Sep 2023
5 NYSE-Listed Emerging Market Stocks For Income Investors - Nasdaq

Financial Analysis

Price to Book Value: Outperform
P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly.
Price to Earnings: Outperform
PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS).
Discounted cash flow: Outperform
DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows.
Return on Assets: Neutral
ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit.
Return on Equity: Neutral
ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency.
Debt to Equity: Outperform
evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn.
Free Technical Analysis Charts

Stock Basics & Statistics

Exchange:  NYSE
Sector:  Technology
Industry:  Semiconductors
Shares Out. 2,150 (M)
Shares Float 1,480 (M)
% Held by Insiders 0 (%)
% Held by Institutions 7.7 (%)
Shares Short 9,220 (K)
Shares Short P.Month 7,710 (K)

Stock Financials

EPS 0.64
EPS Est Next Qtl 0
EPS Est This Year 0
EPS Est Next Year 0
Book Value (p.s.) 129.49
Profit Margin (%) 7.2
Operating Margin (%) 9.7
Return on Assets (ttm) 5.5
Return on Equity (ttm) 16.9
Qtrly Rev. Growth -15.2
Gross Profit (p.s.) 62.75
Sales Per Share 294.51
EBITDA (p.s.) 54.03
Qtrly Earnings Growth -51.3
Operating Cash Flow 115,510 (M)
Levered Free Cash Flow 39,710 (M)

Stock Valuations

PE Ratio 11.56
PEG Ratio -4.1
Price to Book value 0.05
Price to Sales 0.02
Price to Cash Flow 0.13

Stock Dividends

Dividend 0.56
Forward Dividend 0
Dividend Yield 7.5%
Dividend Pay Date Invalid DateTime.
Ex-Dividend Date Invalid DateTime.
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