| 242.27 -2.65 (-1.08%) | 02-23 16:00 | |||||||||||||
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| Short term | |
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| Mid term | |
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| Targets | 6-month : | 294.18 | 1-year : | 343.6 |
| Resists | First : | 251.86 | Second : | 294.18 |
| Pivot price | 231.98 |
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| Supports | First : | 222.63 | Second : | 204.57 |
| MAs | MA(5) : | 240.05 |
MA(20) : | 233.11 |
| MA(100) : | 179.21 |
MA(250) : | 125.34 |
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| MACD | MACD : | 8.6 |
Signal : | 8.9 |
| %K %D | K(14,3) : | 79.5 |
D(3) : | 75.4 |
| RSI | RSI(14): 60.6 |
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| 52-week | High : | 251.86 | Low : | 55.97 |
Price has closed above its short-term moving average. Short-term moving average is currently above mid-term; and above long-term moving average. From the relationship between price and moving averages: This stock is BULLISH in short-term; and BULLISH in mid-long term.[ LRCX ] has closed below upper band by 22.6%. Bollinger Bands are 10.2% wider than normal. The current width of the bands does not suggest anything about the future direction or movement of prices.
| If tomorrow: | Open lower | Open higher |
| High: | 249.77 - 251.03 | 251.03 - 252.06 |
| Low: | 234.55 - 235.84 | 235.84 - 236.9 |
| Close: | 240.35 - 242.4 | 242.4 - 244.09 |
Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. Lam Research Corporation was incorporated in 1980 and is headquartered in Fremont, California.
Tue, 24 Feb 2026
How Investors Are Reacting To Lam Research (LRCX) Expanding Its Boise Footprint With Micron Collaboration - simplywall.st
Mon, 23 Feb 2026
Assessing Lam Research (LRCX) Valuation After Strong Recent Share Price Momentum - Yahoo Finance
Mon, 23 Feb 2026
Lam Research (LRCX) Expands Footprint Amid Industry Momentum - Yahoo Finance Singapore
Mon, 23 Feb 2026
If You Invested $1000 in Lam Research a Decade Ago, This is How Much It'd Be Worth Now - Yahoo Finance
Mon, 23 Feb 2026
O Neil Global Advisors Inc. Buys New Position in Lam Research Corporation $LRCX - MarketBeat
Sun, 22 Feb 2026
Tredje AP fonden Takes Position in Lam Research Corporation $LRCX - MarketBeat
| Price to Book Value: P/BV, a ratio used to compare book value to its current market price, to gauge whether a stock is valued properly. |
Underperform |
| Price to Earnings: PE, the ratio for valuing a company that measures its current share price relative to its earnings per share (EPS). |
Underperform |
| Discounted cash flow: DCF, a valuation method used to estimate the value of an investment based on its expected future cash flows. |
Neutral |
| Return on Assets: ROA, indicates how profitable a company is in relation to its total assets, how efficiently uses assets to generate a profit. |
Outperform |
| Return on Equity: ROE, a measure of financial performance calculated by dividing net income by equity. a gauge of profitability and efficiency. |
Outperform |
| Debt to Equity: evaluate financial leverage, reflects the ability of equity to cover outstanding debts in the event of a business downturn. |
Underperform |
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Exchange:
NASDAQ
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Sector:
Technology
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Industry:
Semiconductors
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| Shares Out | 1,250 (M) |
| Shares Float | 1,240 (M) |
| Held by Insiders | 0.3 (%) |
| Held by Institutions | 89 (%) |
| Shares Short | 30,560 (K) |
| Shares Short P.Month | 33,120 (K) |
| EPS | 4.86 |
| EPS Est Next Qtrly | 0 |
| EPS Est This Year | 0 |
| EPS Est Next Year | 0 |
| Book Value (p.s.) | 8.1 |
| Profit Margin | 30.2 % |
| Operating Margin | 33.8 % |
| Return on Assets (ttm) | 21 % |
| Return on Equity (ttm) | 65.5 % |
| Qtrly Rev. Growth | 22.1 % |
| Gross Profit (p.s.) | 8.19 |
| Sales Per Share | 16.44 |
| EBITDA (p.s.) | 5.87 |
| Qtrly Earnings Growth | 37 % |
| Operating Cash Flow | 7,120 (M) |
| Levered Free Cash Flow | 4,820 (M) |
| PE Ratio | 49.74 |
| PEG Ratio | 0 |
| Price to Book value | 29.87 |
| Price to Sales | 14.72 |
| Price to Cash Flow | 42.53 |
| Dividend | 0.25 |
| Forward Dividend | 0 |
| Dividend Yield | 0.1% |
| Dividend Pay Date | Invalid DateTime. |
| Ex-Dividend Date | Invalid DateTime. |